Thermal Analysis – Celsius

Thermal Analysis – Celsius Studio

Control Heat Early to Avoid Respins!

Power and thermal performance are among the biggest challenges in modern electronics. Celsius Studio provides a single, AI-enabled environment to tackle thermal, stress, and optimization challenges across ICs, packages, and PCBs.

Celsius Studio is organized into five specialized sections, each tailored to address different aspects of thermal, stress, and cooling analysis.

Celsius Layout

Designed for layered structures like PCBs and package substrates, this module supports electrothermal co-simulation directly in the Layout Workbench.

Celsius Electronics Cooling

Celsius Electronics Cooling enables simulation of full 3D solid objects with support for heat sinks, fans, and airflow optimization. It allows engineers to import ECAD or MCAD designs and perform precise air and liquid cooling analysis, helping optimize temperature distribution across the entire system. The module delivers advanced CFD simulation for complex 3D systems and supports the evaluation of thermal management strategies, including the impact of heat sinks and active cooling, all in a single, integrated environment.