IPack Solutions offers a comprehensive software suite from Cadence that spans the entire range of physics, providing access to software simulation and analysis solutions for the high tech industry. Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. 

Cadence offers solutions for semiconductor and system companies, offering the broadest, most integrated end-to-end solution to help today's electronic designers do their best work creating tomorrow's products for:

  • Silicon design creation, simulation, implementation, and signoff of analog and digital circuits; off-the-shelf design IP; and IC packaging, including machine learning-enhanced EDA tools and machine learning-enabled EDA flows.

  • System design of advanced packaging, safe and secure embedded software, and PCBs; analysis of electromagnetic and electrothermal effects of semiconductors, packages, boards, and systems; and co-optimization with semiconductor devices.

Through this strong partner ecosystem, IPack Solutions has the ability to support our customer's design through proof of concept, design validation, new product introduction, pilot and production phases. Collaborating closely, our aim is to lower the overall solution costs, increase technology integration and functionality while shortening the time to market.

Simulation Software Solutions

Circuit and System Simulation (PSpice)

PSpice combines industry-leading, native analog, mixed-signal, and analysis engines to deliver a complete circuit simulation and verification solution. Whether you’re prototyping simple circuits, designing complex systems, or validating component yield and reliability, PSpice technology provides the best, high-performance circuit simulation to analyze and refine your circuits, components, and parameters before committing to layout and fabrication.

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SI/PI Simulation_Sigrity

Integrated with Cadence PCB and IC package design tools, the Sigrity solutions for signal integrity (SI) and power integrity (PI) provide advanced analysis both pre- and post-layout. Operating early in the design cycle allows for “what if” scenario exploration, sets more accurate design constraints, and reduces design iterations. Sigrity tools read and write directly to the Allegro PCB and IC package design database for fast and accurate integration of results. It provides a SPICE-based simulator and embedded field solvers for extraction of 2D and 3D structures. It supports transistor-level and behavioral I/O modeling, including power-aware simulation using IBIS models. Parallel bus and serial channel architecture can be explored pre-layout to compare alternatives, or post-layout for a comprehensive analysis of all associated signals.

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Thermal Simulation_Celsius

Celsius Thermal Solver seamlessly integrates with Cadence IC, package, and Allegro PCB platforms. Fast and accurate parallel simulation enables new system analysis and design insights and empowers electrical design teams to detect and mitigate thermal issues early in the design process - reducing electronic system development iterations. Engineers can combine Cadence Celsius and Sigrity in an accurate electrical and thermal co-simulation (steady-state and transient) system-level thermal simulation for PCB and IC-Packaging based on the actual flow of electrical power.

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Clarity 3D Solver

Clarity 3D Solver is a 3D electromagnetic (EM) simulation software tool for designing critical interconnects for PCBs, IC packages, and system on IC (SoIC) designs. Clarity 3D Solver resolve the most complex electromagnetic (EM) challenges when designing systems for 5G, wifi-6, high-performance computing (HPC), and machine learning applications with gold-standard accuracy. This multiprocessing technology enables to deliver virtually unlimited capacity and 10X speed required to efficiently and effectively address these larger and more complex structures. It creates highly accurate S-parameter models for use in SI, PI, and EMC analysis, enabling simulation results that match lab measurement, even at 112Gbps+ data transfer speeds.

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