SI/PI – Sigrity | Ipack Solutions

SI/PI - Sigrity

Accelerate SI/PI Confidence with Sigrity!

As designs get faster and more complex, signal and power integrity can’t be left to chance. Sigrity delivers advanced electromagnetic and system-level analysis to uncover SI/PI issues early from pre-layout through signoff.

Identify noise, coupling, impedance, and IR drop before they become costly problems. Optimize performance. Reduce redesigns. Bring high-speed products to market with confidence.

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Sigrity Overview

Signal Integrity

Impedance Analysis - Identifies Impedance discontinuities.
Reflection Analysis - Detects signal reflections caused by mismatched Impedances.
Coupling Analysis - Identifies the effect of other nets by determining coupled segments.
Crosstalk Analysis - Identifies victim-aggressor crosstalk effects.
Return Path Analysis - Ensures the continuity of the return path.
Power/Ground Noise - Measures switching noise on specific power/ground traces & shapes.
S- parameters Model Extraction - Extract S, Z, and Y parameters of multiple ports network.

Power Integrity

IR Drop - Analyze static voltage drop in the power network.
Resistance Generation - Analyze system-level power loss for the entire design.
Decoupling Capacitor Optimization - Optimize decoupling capacitor values and locations for stability.
Pin Location Effectiveness - Evaluate how pin placement affects power performance.
Resonance - Detect and minimize resonance peaks in the Power Delivery Network (PDN).
Noise Coupling - Identify and reduce power noise from external sources and coupling paths.

Topology Extraction

Build and simulate high-speed interconnect topologies for PCB and package designs before layout. Optimize routing, terminations, and timing to meet electrical and performance targets with minimal iteration.

Serial - Link Analysis - Model, simulate, and verify high-speed serial link interfaces to ensure signal integrity and compliance with modern communication standards.
Parallel - Bus Analysis - Perform detailed time-domain analysis of parallel bus architectures using IBIS and AMI models to assess timing, signal quality, and protocol compliance even for advanced serial-based protocols.

Challenges

01

High-Speed signals lose quality as they travel, causing reflections, timing issues, and data errors.

03

Designing high-speed signal paths through trial and error is time consuming and often leads to performance issues later in the layout.

05

Excess heat builds up in parts of the board, reducing performance and shortening component lifespan.

02

Power fluctuations during operation cause voltage drops and system instability.

04

Excess noise or interference causes products to fail EMI tests and disrupt nearby systems.

06

At high frequencies, complex geometries and parasitic coupling can cause unexpected signal loss and electromagnetic interference, often leading to failed compliance tests.